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Resources
Credits
News
more post- [ 05 Jan 2014 ] Nanomaterials Could Enable Large, Flexible Touch Screens
- [ 26 Dec 2013 ] Graphene-based Nanoantennas Could Speed Up Wireless Networks
- [ 26 Dec 2013 ] Compound Semiconductors Join the Race to Sustain Moore’s Law
- [ 13 Dec 2013 ] Samueli Sees Life After Moore's Law
- [ 11 Dec 2013 ] Think 3D Printing is Cool? How About Printing Your Own Electronics
Events
more post- [ 23 Jan 2014 ]
- [ 27 - 29 Jan 2014 ] EUROSOI 2014, Tarragona, Catalonia, Spain
- [ 07 - 09 Apr 2014 ] ULIS 2014, Stockholm, Sweden
- [ 28 - 30 Apr 2014 ] 2014 VLSI-TSA, Hsinchu, Taiwan
- [ 28 - 30 Apr 2014 ] 2014 VLSI-DAT, Hsinchu, Taiwan
Articles
more post-
i-MOS Users' Manual
(Lining Zhang, Hao Wang, Mansun Chan, 2013) -
Carbon Nanotube Science
(Peter J. F. Harris, 2012) -
Introduction to Nanoelectronics
(Vladimir V. Mitin, 2012) -
Compact Hierarchical Bipolar Transistor Modeling with HICUM
(Michael Schröter and Anjan Chakravorty, 2012) -
MOSFET Models for SPICE Simulation: including BSIM3v3 and BSIM4
(William Liu, 2011)
Organizations
more post- Compact Model Council(CMC)
- Compact Modelling Network (COMON)
- European compact modeling group (MOS-AK)
- Global Semiconductor Alliance Mixed-Signal/RF Subcommittee (GSA-MS/RF)
- IEEE Council on Electronic Design Automation (CEDA)
Device Models
more post- aMOS, DC MOSFET, Texas Instruments, USA
- ASIM, IGFET, AT&T Bell Labs, USA
- BSIM, MOSFET, University of California at Berkeley, USA
- BSIMSOI, SOI, University of California at Berkeley, USA
- EKV, MOSFET, Swiss Federal Institute of Technology (EPFL), Switzerland
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-MOS Team